Method for assembly of printed circuit boards with ultrafine pitch components using organic solderability preservatives
US5679266A · kind A · utility
3Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 1996 |
| Grant date | Oct 21, 1997 |
| Priority date | — |
| Expiry date | Jan 16, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of assembling a printed circuit (PC) boards with ultrafine pitch components. The method comprises: attaching a coarse pitch components on the PC board; applying solvent to the thermal pads of the ultrafine pitch components; mounting a die-attach film on the thermal pads; curing the die-attach film; applying solvent to the die-attach film; forming component leads for the ultrafine pitch components; aligning the ultrafine pitch components to the solder pads; attaching the component leads to the solder pads and the ultrafine pitch components to the thermal pads. Other devices, systems and methods are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.