Chris Thornton
2Patents
2h-index
4Co-inventors
27Inventor score
Filing activity: Aug 25, 1995 → Jan 16, 1996
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5811317A | Process for reflow bonding a semiconductor die to a substrate and the product produced by the product | Emerging Cross-Sectional Technologies | 37 | Expired |
| US5679266A | Method for assembly of printed circuit boards with ultrafine pitch components using organic solderability preservatives | Emerging Cross-Sectional Technologies | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.