Thermally conductive interface for electronic devices
US5679457A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 18, 1996 |
| Grant date | Oct 21, 1997 |
| Priority date | — |
| Expiry date | Mar 18, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A mechanically conformable thermally conductive interface for use in electrically isolating and thermally connecting printed circuit boards to either beat sinks, metal chasses, or heat spreaders. The interface material utilizes silicone polymers of controlled molecular weight and a surface layer of a pressure sensitive adhesive may be employed. The silicone polymer is filled with a thermally conductive electrically insulative particulate such as alumina and/or boron nitride, with the silicone being prepared as a reaction product of a liquid organosiloxane together with a chain extender such as a hydride terminated polydimethylsiloxane material. A release film such as polyethylene may be utilized as the undersurface layer, if desired.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.