Steven E. Bergerson
4Patents
4h-index
3Co-inventors
39Inventor score
Filing activity: Mar 18, 1996 → Jun 11, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6090484A | Thermally conductive filled polymer composites for mounting electronic devices and method of application | Emerging Cross-Sectional Technologies | 60 | Expired |
| US5679457A | Thermally conductive interface for electronic devices | Emerging Cross-Sectional Technologies | 57 | Expired |
| US7147367B2 | Thermal interface material with low melting alloy | Emerging Cross-Sectional Technologies | 49 | Expired |
| US6776923B2 | Self-adhering thermal interface material | Chemistry; Metallurgy | 9 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.