Method for producing high density multi-layer integrated circuit carriers
US5679498A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 1995 |
| Grant date | Oct 21, 1997 |
| Priority date | — |
| Expiry date | Oct 11, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1407
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of producing multi-layered chip carriers by coating the surface of a base layer with a photosensitive dielectric material which forms a dielectric layer; curing at least a portion of the dielectric layer by exposure to radiation; depositing a catalyst on the cured portion of the dielectric layer to form a sensitized dielectric layer; applying a photoresist layer upon the sensitized dielectric layer; curing at least a portion of the photoresist layer; developing the cured photoresist layer by removing uncured portions, thereby exposing corresponding portions of the underlying sensitized dielectric layer; forming conductors on the exposed dielectric layer; stripping the cured photoresist layer: coating a layer of photosensitive dielectric material upon the cured dielectric layer; and repeating the steps to produce successive layers which form a multi-layer chip carrier having a plurality of conductor layers separated by layers of insulating dielectric material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.