Heatspreader carrier strip
US5681663A · kind A · utility
9Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 1995 |
| Grant date | Oct 28, 1997 |
| Priority date | — |
| Expiry date | Jun 9, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12917
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An intermediate workpiece includes a first strip of laminated material exhibiting high thermal conductivity and which is subject to bowing in response to thermal cycling. A second strip of copper material is welded to the first strip along a longitudinal abutting edge of each strip. The first strip is partitioned into smaller heatspreader sections each for having a semiconductor die soldered thereto. Thermal manufacturing cycles will not cause a bowing of the second strip or of the heatspreader sections attached thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.