Rapid thermal processing apparatus for processing semiconductor wafers
US5683518A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 21, 1994 |
| Grant date | Nov 4, 1997 |
| Priority date | — |
| Expiry date | Jan 21, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/0047
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A novel rapid thermal process (RTP) reactor processes a multiplicity of wafers or a single large wafer, e.g., 200 mm (8 inches), 250 mm (10 inches), 300 mm (12 inches) diameter wafers, using either a single or dual heat source. The wafers or wafer are mounted on a rotatable susceptor supported by a susceptor support. A susceptor position control rotates the wafers during processing and raises and lowers the susceptor to various positions for loading and processing of wafers. A heat controller controls either a single heat source or a dual heat source that heats the wafers to a substantially uniform temperature during processing. A gas flow controller regulates flow of gases into the reaction chamber. Instead of the second heat source, a passive heat distribution element is used, in one embodiment, to achieve a substantially uniform temperature throughout the wafers. Further, a novel susceptor is used that includes a wafer surround ring around the wafer and, in some embodiments, a spindle and/or a susceptor insert underneath the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.