Process for making a Z-axis adhesive and establishing electrical interconnection therewith
US5685939A · kind A · utility
65Cited by
31References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1995 |
| Grant date | Nov 11, 1997 |
| Priority date | — |
| Expiry date | Mar 10, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A Z-axis adhesive is produced by dispersing electrically-conductive particles in an organic binder and then imagewise exposing the material to electromagnetic radiation, preferably from a laser or a flash lamp, under conditions sufficient to transfer the particles from the binder to a receptor in a patterned fashion such that the resulting adhesive is a Z-axis conductor in the patterned areas. The patterned adhesive can then be used to establish electrical interconnection between facing electrodes of a number of different structures including semiconductor chips and a flexible printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.