Package for electrical components having a molded structure with a port extending into the molded structure
US5686698A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1994 |
| Grant date | Nov 11, 1997 |
| Priority date | — |
| Expiry date | Jun 30, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48472
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A package for mounting electrical components and a method for making the package. A mold structure (50) is formed by encapsulating a portion of a leadframe (10) with a molding compound. Leads (23) project from one side of the mold structure and a portion of a tab (27) projects from another side of the mold structure, which has a cavity (57) between the leads (23) and the tab (27). In addition, the mold structure has vent holes (76) between the leads (23) and an aperture (62) extending to the cavity. After mounting a semiconductor chip (64) in the cavity (57), it is covered by a lid (53) and a portion (24) of the leads (23) and a portion (29) of the tab (27) are formed. The tab (27) provides structural rigidity to the mold structure (50) and permits surface mounting the mold structure (50).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.