Dave S. Mahadevan
4Patents
4h-index
11Co-inventors
47Inventor score
Filing activity: Jun 30, 1994 → Sep 25, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7030469B2 | Method of forming a semiconductor package and structure thereof | Electricity | 274 | Expired |
| US6401545B1 | Micro electro-mechanical system sensor with selective encapsulation and method therefor | Electricity | 84 | Expired |
| US5686698A | Package for electrical components having a molded structure with a port extending into the molded structure | Electricity | 27 | Expired |
| US7012324B2 | Lead frame with flag support structure | Electricity | 8 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.