Method for transfer molding standard electronic packages and apparatus formed thereby
US5689137A · kind A · utility
11Cited by
8References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 16, 1995 |
| Grant date | Nov 18, 1997 |
| Priority date | — |
| Expiry date | Oct 16, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C45/14418
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for transfer molding a standard electronic package and an apparatus resulting from such method. A seal is formed between a portion of the mold platens of the mold and a portion of a printed circuit board adjacent to electrical contacts along at least one side of the printed circuit board. After the apparatus is removed from the mold, a protective cap is placed over the electrical contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.