Metal foil for printed wiring board and production thereof
US5689879A · kind A · utility
22Cited by
8References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1994 |
| Grant date | Nov 25, 1997 |
| Priority date | — |
| Expiry date | Dec 16, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12993
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed between the first and second copper layers is suitable for producing printed wiring boards having excellent heat resistance, particularly during production procedures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.