Ion milling end point detection method and apparatus
US5690784A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 1994 |
| Grant date | Nov 25, 1997 |
| Priority date | — |
| Expiry date | Jun 20, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/304
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An ion milling end point detection method for etching coated substrates is disclosed comprising the use of a light measurement of light passing through a monitor substrate (e.g., glass coated with the same material at about the same thickness as the coated substrate to be etched) during the milling process, comparing the light values with a reference value and determining the end point of the milling process based on said values. Coated and uncoated monitor substrates may also be employed together and the values compared to determine the end point. An apparatus for determining the end point of an ion milling process is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.