Method and apparatus for layer depositions
US5690796A · kind A · utility
9Cited by
6References
44Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 1995 |
| Grant date | Nov 25, 1997 |
| Priority date | — |
| Expiry date | Dec 5, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/0078
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
It is suggested for depositing layers of mechanically resistant material, in particular on highly stressed tools, to coat the workpieces (7) alternatingly by means of reactive cathode sputtering (1, 13) and to after-treat them by means of a further plasma discharge (3).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.