Sheet material for laminate of printed circuit and laminate for printed circuit using the same
US5692940A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jul 15, 1996 |
| Grant date | Dec 2, 1997 |
| Priority date | — |
| Expiry date | Jul 15, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/689
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A substrate for a laminate which comprises a nonwoven fabric which is composed mainly of a liquid crystal polyester fiber, and which is subjected to (1) an entangling treatment, (2) a heating treatment to impart adhesivity to a thermosetting resin, and (3) a surface-modifying treatment, and a laminate containing at least one prepreg prepared by impregnating the substrate with a thermosetting resin and drying are disclosed. The substrate of the present invention has low dielectric constant, is light, exhibits low hygroscopicity, and has good properties to be impregnated with the thermosetting resin and good adhesiveness to the thermosetting resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.