Semiconductor chips suitable for known good die testing
US5693565A · kind A · utility
57Cited by
12References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 1996 |
| Grant date | Dec 2, 1997 |
| Priority date | — |
| Expiry date | Jul 15, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor integrated circuit (IC) die is made with enhanced resilience to handling, testing, and storage, associated with its qualification and distribution as a KNOWN GOOD DIE (KGD). The IC device has a mechanically tough and chemically inert top layer to protect it from damage. The device contacts are made of thin film metals which facilitate reversible electrical connections used in KGD testing. The overall contact structure protects the device from irreversible damage during the connection, test, and disconnection sequence.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.