Thermocompression bonding equipment
US5698068A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 1995 |
| Grant date | Dec 16, 1997 |
| Priority date | — |
| Expiry date | Apr 27, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C66/8223
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
This invention provides a thermocompression bonding equipment which, when the material to be bonded is to be changed, allows easy replacement and preparation of a compression bonding head, reduction of working time required for replacement and preparation of a compression bonding head, and simplified adjustment of the compression bonding head. The thermocompression bonding equipment is provided with a head unit 20 comprising a base 10, thermocompression bonding head 56 and sliding mechanism 50 for sliding the thermocompression bonding head 56 provided on the base 10, pressing means 30, which are structured independently from the head unit, for pressing the sliding mechanism 50 to slide the thermocompression bonding head 56, thereby thermocompression bonding the material of ACF, LCD, and TAB, and a base frame 40 provided with positioning means 40, 41 for positioning the base 10.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.