Heat pipe to baseplate attachment method
US5699227A · kind A · utility
27Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 1996 |
| Grant date | Dec 16, 1997 |
| Priority date | — |
| Expiry date | Jun 28, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49353
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package which has a heat pipe that is incorporated into the body of the package. The package contains an integrated circuit which is mounted to a package substrate. The integrated circuit die is enclosed by a cover plate that is attached to the substrate. The heat pipe is attached to a nut that is screwed into the cover plate. The heat pipe has a bottom surface that is thermally coupled to the die to provide a direct thermal path between the integrated circuit and the heat pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.