Michael Brownell
22Patents
11h-index
22Co-inventors
67Inventor score
Filing activity: Mar 28, 1996 → Mar 28, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5990552A | Apparatus for attaching a heat sink to the back side of a flip chip package | Electricity | 65 | Expired |
| US5991161A | Multi-chip land grid array carrier | Emerging Cross-Sectional Technologies | 58 | Expired |
| US6410982B1 | Heatpipesink having integrated heat pipe and heat sink | Electricity | 57 | Expired |
| US6166908A | Integrated circuit cartridge | Electricity | 53 | Expired |
| US5699229A | Compliant hinge clip attachment | Electricity | 43 | Expired |
| US6016006A | Thermal grease insertion and retention | Electricity | 36 | Expired |
| US5699227A | Heat pipe to baseplate attachment method | Emerging Cross-Sectional Technologies | 27 | Expired |
| US5949647A | Heat pipe to baseplate attachment method | Emerging Cross-Sectional Technologies | 23 | Expired |
| US5903436A | Emulative lid/heatspreader for processor die attached to an organic substrate | Electricity | 19 | Expired |
| US6097611A | Multi-chip land grid array carrier | Emerging Cross-Sectional Technologies | 16 | Expired |
| US5802707A | Controlled bondline thickness attachment mechanism | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6164999A | Zero insertion force socket and method for employing same to mount a processor | Electricity | 11 | Expired |
| US5953164A | Wide range cylindrical mirror mount with radial clamp | Physics | 9 | Expired |
| US5847885A | Wide range cylindrical mirror mount with radial clamp | Physics | 8 | Expired |
| US6614829B1 | Mechanically grounded tunable laser | Electricity | 8 | Expired |
| US6506073B2 | Mounting bracket for integrated circuit device | Electricity | 6 | Expired |
| US6443749B2 | Fixed position ZIF (zero insertion force) socket system | Electricity | 6 | Expired |
| US6002591A | Printed circuit board mounting assembly and a method for mounting an integrated circuit device | Electricity | 4 | Expired |
| US6349465B1 | Controlled bondline thickness attachment mechanism | Emerging Cross-Sectional Technologies | 4 | Expired |
| US5956229A | Injection molded thermal interface system | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6782611B2 | Method of assembling a multi-chip device | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6490167B1 | Semiconductor package ejector | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.