Power semiconductor module having a plastic housing a metal/ceramic multilayer substrate and terminals in a soft encapsulation

US5699232A · kind A · utility

Assignee

• IXYS Semiconductor GmbH · DE

Inventors

• Arno Neidig · Plankstadt, DE
• Peter Kinzel · Westerham, DE

Key dates

• Filing date: Dec 26, 1995
• Grant date: Dec 16, 1997
• Expiry date: Dec 26, 2015

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A power semiconductor module includes a plastic housing having a bottom plane in which a substrate is disposed. Disposed inside the module are the substrate, structures on the substrate, a rubber-like soft encapsulation and a hard encapsulation above the soft encapsulation. Internal struts of the housing extend into the soft encapsulation and, if appropriate, have ends with transverse extensions disposed within the soft encapsulation. The effect of this module construction is that a back pressure or reaction opposes forces acting externally on the substrate.