Method for drying micromechanical components
US5700379A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 14, 1996 |
| Grant date | Dec 23, 1997 |
| Priority date | — |
| Expiry date | Feb 14, 2016 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF26B5/005
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A micromechanical structure is etched on a component that has been introduced into a container having a plurality of inlet and discharge openings. The liquid etchant is displaced downwardly through a liquid discharge at the underside of the container by admitting water through the liquid inlet at the upper side, whereby no turbulence occurs in the liquid flow. The water employed as a rinsing agent is displaced by a liquid having a lower density such as, for example, ethanol or acetone. Finally, a liquefied gas, for example liquid carbon dioxide, is admitted via the liquid, this gas is evaporated by heating the container above the critical temperature, the pressure in the inside of the container is reduced to the ambient air pressure by opening a gas discharge, and the component is removed from the container through a sluice or lock.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.