Apparatus for testing flip chip or wire bond integrated circuits
US5701085A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 5, 1995 |
| Grant date | Dec 23, 1997 |
| Priority date | — |
| Expiry date | Jul 5, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for use in testing wire bond or flip chip connected integrated circuits includes a housing with a top side, a bottom side, and a perimeter region defining a housing central aperture. The housing further includes flip chip pads to accommodate flip chip solder connections to a flip chip integrated circuit during a first test period and wire bond pads to accommodate wire bond connections to a wire bond integrated circuit during a second test period. There are connector pins on the bottom side of the housing for connection with a printed circuit board. The printed circuit board includes an access aperture which is aligned with the housing central aperture. This configuration allows a test probe to access a flip chip integrated circuit positioned within the housing. It also allows a heat sink to be used when the housing incorporates a wire bonded integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.