Deviprasad Malladi
20Patents
11h-index
22Co-inventors
71Inventor score
Filing activity: Jun 17, 1993 → Mar 30, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5528083A | Thin film chip capacitor for electrical noise reduction in integrated circuits | Emerging Cross-Sectional Technologies | 85 | Expired |
| US5629240A | Method for direct attachment of an on-chip bypass capacitor in an integrated circuit | Electricity | 60 | Expired |
| US5701085A | Apparatus for testing flip chip or wire bond integrated circuits | Electricity | 48 | Expired |
| US5972736A | Integrated circuit package and method | Electricity | 47 | Expired |
| US5367193A | Low cost, thermally efficient, and surface mountable semiconductor package for a high applied power VLSI die | Electricity | 39 | Expired |
| US5831333A | Integrated junction temperature sensor/package design and method of implementing same | Electricity | 38 | Expired |
| US5780930A | Method for direct attachment of an on-chip bypass capacitor in an integrated circuit | Electricity | 24 | Expired |
| US6246252A | Efficient debug package design | Electricity | 13 | Expired |
| US6944025B2 | EMI shielding apparatus | Electricity | 12 | Expired |
| US5734554A | Heat sink and fan for cooling CPU chip | Electricity | 12 | Expired |
| US5598035A | Integrated circuit package with external storage capacitor for improved signal quality for sensitive integrated circuit elements | Electricity | 12 | Expired |
| US6636825B1 | Component level, CPU-testable, multi-chip package using grid arrays | Physics | 11 | Expired |
| US6637506B2 | Multi-material heat spreader | Electricity | 10 | Expired |
| US6436737B1 | Method for reducing soft error rates in semiconductor devices | Electricity | 10 | Expired |
| US6472900B1 | Efficient device debug system | Electricity | 8 | Expired |
| US7301227B1 | Package lid or heat spreader for microprocessor packages | Electricity | 7 | Expired |
| US6351389B1 | Device and method for packaging an electronic device | Electricity | 7 | Expired |
| US7939364B2 | Optimized lid attach process for thermal management and multi-surface compliant heat removal | Electricity | 6 | Active |
| US6727193B2 | Apparatus and methods for enhancing thermal performance of integrated circuit packages | Electricity | 1 | Expired |
| US8283204B2 | Optimized lid attach process for thermal management and multi-surface compliant heat removal | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.