Semiconductor integrated circuit device and method of producing the semiconductor integrated circuit device
US5703398A · kind A · utility
29Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 1996 |
| Grant date | Dec 30, 1997 |
| Priority date | — |
| Expiry date | Jun 20, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor integrated circuit device includes a semiconductor chip supported by a stage, leads electrically connected to the semiconductor chip, first and second heat radiating members provided on first and second sides of the semiconductor chip, and a resin package body completely sealing the semiconductor chip and partially sealing the leads and the first and second heat radiating members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.