Non-contact IC card and process for its production
US5705852A · kind A · utility
99Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 9, 1996 |
| Grant date | Jan 6, 1998 |
| Priority date | — |
| Expiry date | Apr 9, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In a non-contact IC card comprising a substrate and provided thereon at least an IC chip and an antenna coil formed by etching, a connecting terminal of the antenna coil and a connecting bump of the IC chip are interconnected in a face-down fashion via an anisotropic conductive adhesive layer, or interconnected by wire bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.