Hideyuki Kurita
25Patents
9h-index
16Co-inventors
68Inventor score
Filing activity: Apr 9, 1996 → Jun 16, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5705852A | Non-contact IC card and process for its production | Electricity | 99 | Expired |
| US6643923B1 | Processes for manufacturing flexible wiring boards | Emerging Cross-Sectional Technologies | 23 | Expired |
| US6404052B1 | Multi-layer flexible printed wiring board | Electricity | 15 | Expired |
| US6420659B1 | Flexible wiring board pieces and wiring sheets | Electricity | 11 | Expired |
| US6448647B1 | BGA package substrate | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6399891B1 | Multilayer boards | Electricity | 11 | Expired |
| US6323434A | Circuit board and production method thereof | Electricity | 11 | Expired |
| US6596947B1 | Board pieces, flexible wiring boards, and processes for manufacturing flexible wiring boards | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6583364B1 | Ultrasonic manufacturing apparatuses, multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6658722B1 | Process for producing magnetic head suspension | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6809267B1 | Flexible printed wiring board and its production method | Electricity | 9 | Expired |
| US6729022B2 | Processes for manufacturing flexible wiring boards and the resulting flexible wiring boards | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6344308B1 | Method of manufacturing a flexible circuit board | Electricity | 4 | Expired |
| US6437251B1 | Flexible board made by joining two pieces through an adhesive film | Electricity | 4 | Expired |
| US6840430B2 | Board pieces, flexible wiring boards and processes for manufacturing flexible wiring boards | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6848176B2 | Process for manufacturing flexible wiring boards | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6705007B1 | Method for manufacturing double-sided flexible printed board | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6926187B2 | Ultrasonic manufacturing apparatus | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6717064B1 | Substrate piece and flexible substrate | Electricity | 2 | Expired |
| US7053312B2 | Flexible wiring boards | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6991148B2 | Process for manufacturing multilayer flexible wiring boards | Emerging Cross-Sectional Technologies | 2 | Expired |
| US7005323B2 | Method and apparatus for shielding integrated circuits | Electricity | 1 | Expired |
| US7213334B2 | Method for manufacturing double-sided flexible printed board | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6812060B1 | Multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6737588B1 | Processes for manufacturing flexible wiring boards and the resulting flexible wiring board | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.