Method of assembling integrated circuit package
US5706579A · kind A · utility
39Cited by
4References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 9, 1996 |
| Grant date | Jan 13, 1998 |
| Priority date | — |
| Expiry date | Apr 9, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package capable of carrying high wattage and efficiently dissipating heat generated by the die is fabricated from a die, printed wiring board and metal lid, with a beta-stageable resin which is preapplied to the lid and which contains a thermally conductive filler material. With the lid in place over the die and substrate board, the package is heated to cause the resin to flow and establish contact with the die. Further heating causes curing of the resin and a permanent thermal bridge between the die and the lid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.