Lead frame and method of manufacturing the same, and resin sealed semiconductor device and method of manufacturing the same
US5708295A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 1996 |
| Grant date | Jan 13, 1998 |
| Priority date | — |
| Expiry date | Apr 26, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a space surrounded by outer frames formed in the shape of as rectangle is disposed a die pad in the shape of a square for mounting a semiconductor chip having electrodes. Each of the outer frames is connected with a plurality of outer leads respectively continuous with inner leads which are used for electrical connection and extended toward the die pad. Each inner lead is extended to the vicinity of a position where each electrode of the semiconductor chip is to be formed. The corners of the die pad are respectively provided with support members extending to positions away from a dam bar by a predetermined distance. The support members are connected with the inner leads via a square ring-shaped insulating member. Thus, the die pad is supported by the outer frames via the support members. Since there is no need to provide a die pad lead, the space at the corner conventionally occupied by the die pad lead can be utilized for wiring, and the leads can be easily led in.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.