Toru Nomura
19Patents
11h-index
13Co-inventors
69Inventor score
Filing activity: Jun 1, 1992 → Oct 1, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6225146A | Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device | Electricity | 226 | Expired |
| US5977615A | Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device | Electricity | 141 | Expired |
| US6674154B2 | Lead frame with multiple rows of external terminals | Electricity | 74 | Expired |
| US6710430B2 | Resin-encapsulated semiconductor device and method for manufacturing the same | Electricity | 71 | Expired |
| US6498393B2 | Semiconductor device and method for the fabrication thereof | Electricity | 27 | Expired |
| US5321249A | Solid-state imaging device and method of manufacturing the same | Electricity | 19 | Expired |
| US6680220B2 | Method of embedding an identifying mark on the resin surface of an encapsulated semiconductor package | Electricity | 15 | Expired |
| US5759367A | Gas sensor | Physics | 14 | Expired |
| US6680524B2 | Semiconductor device and method for fabricating the same | Electricity | 12 | Expired |
| US6909168B2 | Resin encapsulation semiconductor device utilizing grooved leads and die pad | Electricity | 12 | Expired |
| US7026192B2 | Terminal land frame and method for manufacturing the same | Electricity | 11 | Expired |
| US6692991B2 | Resin-encapsulated semiconductor device and method for manufacturing the same | Electricity | 9 | Expired |
| US5336367A | Solid-state imaging device and method of manufacturing the same | Electricity | 7 | Expired |
| US6667541B1 | Terminal land frame and method for manufacturing the same | Electricity | 7 | Expired |
| US5708295A | Lead frame and method of manufacturing the same, and resin sealed semiconductor device and method of manufacturing the same | Electricity | 6 | Expired |
| US7338838B2 | Resin-encapsulation semiconductor device and method for fabricating the same | Electricity | 2 | Active |
| US7309624B2 | Semiconductor device and method for the fabrication thereof including grinding a major portion of the frame | Electricity | 1 | Active |
| US7125751B2 | Semiconductor device and method for the fabrication thereof grinding frame portion such that plural electrode constituent portions | Electricity | 1 | Expired |
| US9925660B2 | Method for positioning micro-tool and micro-manipulator device | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.