Patent · US Expired

Method for the generation of stacking-fault-induced damage on the back of semiconductor wafers

US5710077A · kind A · utility

7Cited by

6References

5Claims

0Family size

Assignee

Wacker Siltronic Gesellschaft Fur Halbleitermaterialien AG · DE

Inventors

Gerhard Brehm · Emmerting, DE
Rudolf Mayrhuber
Johann Niedermeier · Burghausen, DE

Key dates

Filing date	Jul 9, 1996
Grant date	Jan 20, 1998
Priority date	—
Expiry date	Jul 9, 2016

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/322
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method for the generation of stacking-fault-induced damage on the back of emiconductor wafers is by treating the back with loose hard-material particles which are suspended in a liquid. The back of the semiconductor wafer is brought into contact with the suspended hard-material particles and the hard-material particles are propelled tangentially to the back, under which circumstances they exert on the back of the semiconductor wafer forces which have essentially only tangentially directed components.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.