Process for producing a silica sintered product for a multi-layer wiring substrate
US5714112A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 1995 |
| Grant date | Feb 3, 1998 |
| Priority date | — |
| Expiry date | Dec 5, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4676
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for producing a silica sintered product for a multi-layer wiring substrate of the invention includes: providing a fine silica powder having an average particle size of 5 to 500 nm and a fine crystallized quartz powder having an average particle size 1 to 10 .mu.m, the fine crystallized quartz powder having a volume equal to 1 to 20% of the entire volume of the fine silica powder and the fine crystallized quartz powder; mixing the fine silica powder and the fine crystallized quartz powder with a binder and a solvent to form a silica-containing slurry; forming a green sheet by slip-casting the silica-containing slurry; and firing the green sheet at a temperature of 800.degree. to 1200.degree. C. in an atmosphere containing steam at a partial pressure of 0.005 to 0.85 atm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.