Polyimide resin composition
US5714572A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 23, 1996 |
| Grant date | Feb 3, 1998 |
| Priority date | — |
| Expiry date | Oct 23, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a polyimide resin composition comprising: PA1 (a) a polyamide resin comprising a repeating unit represented by the general formula (1): ##STR1## wherein X represents a tetravalent organic group represented by the formula (2): ##STR2## Y represents a divalent organic group comprising a divalent siloxane residual group represented by the formula (3): ##STR3## wherein m is an integer of 60 to 120; and a divalent aromatic group represented by the formula (4): ##STR4## wherein R.sup.1 represents a hydrogen atom or a fluorine atom; and (B) cyclohexanone. From this composition, polyimide resin films can be obtained by heating at a lower temperature for a short time, and the films obtained show good adhesion under moisture-resistant conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.