Multi-layer, multi-chip pyramid and circuit board structure
US5715144A · kind A · utility
90Cited by
14References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 1996 |
| Grant date | Feb 3, 1998 |
| Priority date | — |
| Expiry date | May 24, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1115
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides multi-layer multi-chip circuit board comprising at least two ATAB carriers having chips thereon, stacked upon each other in a pyramid configuration and attached to a substrate, thus reducing the required area on the substrate for mounting components to form a circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.