Method of making plastic-packaged semiconductor integrated circuit
US5715593A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 29, 1997 |
| Grant date | Feb 10, 1998 |
| Priority date | — |
| Expiry date | Jan 29, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a plastic-packaged semiconductor integrated circuit including (a) an inner lead having a lead-on-chip (LOC) type structure,(b) a ball grid array (BGA) type terminals for electrically connecting the inner lead to an external circuit, and (c) an outer package made of thermosetting resin for shielding the inner lead therein. Specifically, the plastic-packaged semiconductor integrated circuit includes (a) a pellet on which an electronic circuit is mounted and at a surface of which are formed at least one bonding pad, (b) at least one inner lead disposed partially overlapping the pellet so that one end thereof is located on the inner lead and the other end is exposed outside through thermosetting resin layer, the inner lead being wire-bonded with the bonding pad, (c) a thermosetting resin layer for packaging the pellet and the inner lead therein, and (d) at least one solder ball formed in a hole formed throughout the resin layer so that the solder ball is electrical contact with the inner lead, the solder ball having a head projecting above the resin layer. The above mentioned plastic-packaged semiconductor integrated circuit does not need to have outer leads, resultin…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.