Multilayer printed circuit
US5716663A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 1995 |
| Grant date | Feb 10, 1998 |
| Priority date | — |
| Expiry date | Jun 7, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1105
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods for fabricating single and multilayer printed boards which employ electronically conductive adhesive compositions are provided. The composition comprises a solder powder, a chemically protected cross-linking agent with fluxing properties and a reactive monomer or polymer as the principal components. The compositions may also comprise three or more of the following: a relatively high melting metal powder; solder powder; the active cross-linking agent which also serves as a fluxing agent; a resin; a reactive monomer or polymer; and a metal additive. Compositions comprising metal powder are ideally suited for creating the conductive paths and vias on printed circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.