Miguel A. Capote
19Patents
17h-index
19Co-inventors
75Inventor score
Filing activity: Apr 15, 1982 → Feb 19, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6335571B1 | Semiconductor flip-chip package and method for the fabrication thereof | Electricity | 224 | Expired |
| US6297560A | Semiconductor flip-chip assembly with pre-applied encapsulating layers | Electricity | 169 | Expired |
| US5716663A | Multilayer printed circuit | Electricity | 158 | Expired |
| US6121689A | Semiconductor flip-chip package and method for the fabrication thereof | Electricity | 143 | Expired |
| US6399426B1 | Semiconductor flip-chip package and method for the fabrication thereof | Electricity | 129 | Expired |
| US5985456A | Carboxyl-containing polyunsaturated fluxing adhesive for attaching integrated circuits | Emerging Cross-Sectional Technologies | 109 | Expired |
| US5830389A | Electrically conductive compositions and methods for the preparation and use thereof | Electricity | 104 | Expired |
| US6518677B1 | Semiconductor flip-chip package and method for the fabrication thereof | Electricity | 100 | Expired |
| US5376403A | Electrically conductive compositions and methods for the preparation and use thereof | Electricity | 100 | Expired |
| US5538789A | Composite substrates for preparation of printed circuits | Emerging Cross-Sectional Technologies | 49 | Expired |
| US5985043A | Polymerizable fluxing agents and fluxing adhesive compositions therefrom | Electricity | 48 | Expired |
| US5565267A | Composite substrates for preparation of printed circuits | Emerging Cross-Sectional Technologies | 37 | Expired |
| US6774493B2 | Semiconductor flip-chip package and method for the fabrication thereof | Electricity | 37 | Expired |
| US6566234B1 | Semiconductor flip-chip package and method for the fabrication thereof | Electricity | 34 | Expired |
| US4451915A | Optical storage system employing a multi-layer optical medium | Physics | 30 | Expired |
| US6132646A | Polmerizable fluxing agents and fluxing adhesive compositions therefrom | Electricity | 30 | Expired |
| US4451914A | Optical storage system employing a multi-layer optical medium | Emerging Cross-Sectional Technologies | 19 | Expired |
| US7888411B2 | Thermally conductive adhesive composition and process for device attachment | Emerging Cross-Sectional Technologies | 5 | Active |
| US6616984B1 | Forming viaholes in composition of cyanate, bismaleimide, epoxy resin and unsaturated aromatic glycidyl | Emerging Cross-Sectional Technologies | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.