Patent · US Expired

Method of making a thin film transistor

US5716879A · kind A · utility

84Cited by
11References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 13, 1997
Grant dateFeb 10, 1998
Priority date
Expiry dateJan 13, 2017

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D30/6715

Abstract

A structure and fabricating method of a thin film transistor which is suitable for an SRAM memory cell. The thin film transistor structure includes: an insulation substrate; a gate electrode formed on the insulation substrate; a gate insulation film formed on the gate electrode and on the insulation substrate; a semiconductor layer formed on the gate insulation film; channel regions formed in parts of the semiconductor layer at both sides of the gate electrode; a high density first conductive type first impurity region formed in the semiconductor layer over the gate electrode; and first conductive type second impurity regions of having an LDD structure formed in parts of the semiconductor layer over the insulation substrate except under the gate electrode. The method for fabricating a thin film transistor includes processes for: forming a gate electrode on an insulation substrate and forming a gate insulation film on the overall surface thereof; forming a semiconductor layer on the gate insulation film; forming diffusion preventing spacers on the semiconductor layer; forming impurity-containing spacers on the diffusion preventing spacers; diffusing impurities from the impurity-cont…

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.