Antenna having elements with improved thermal impedance
US5717231A · kind A · utility
19Cited by
10References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 1996 |
| Grant date | Feb 10, 1998 |
| Priority date | — |
| Expiry date | Jul 16, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip-chip integrated circuit having passive 302, 304, 306 as well as active 308, 310 components on a frontside surface of a substrate. The active device have airbridges which contact a heatsink to provide heat dissipation from the junctions of the devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.