Photoresist coating apparatus
US5720814A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Feb 21, 1996 |
| Grant date | Feb 24, 1998 |
| Priority date | — |
| Expiry date | Feb 21, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/162
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A supporting plate is disposed above a rotating stage to drive rotatively a semiconductor wafer mounted thereon, and a nozzle fitting rotating disk is secured to the supporting plate rotatively. The rotating center of the nozzle fitting rotating disk is disposed at a position eccentric from a central axis line of the rotating stage. At least one nozzle group in rows composed of a plurality of nozzles for ejecting a photoresist on the semiconductor wafer is fitted to the nozzle fitting rotating disk at intervals in a radial direction of the disk. At least one fitting position of the plurality of nozzles composing nozzle groups is adjustable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.