Dishing and erosion monitor structure for damascene metal processing
US5723874A · kind A · utility
13Cited by
9References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 1996 |
| Grant date | Mar 3, 1998 |
| Priority date | — |
| Expiry date | Jun 24, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to the preferred embodiment, an erosion and dishing monitor is provided that facilitates the accurate optimization of a planarization process as in semiconductor process. The dishing monitor comprises at least two monitor structure sets embedded in a semiconductor substrate, the monitor structure sets comprising a plurality of monitor structures connected together with a plurality of connective conductors. The erosion monitor comprises a plurality of elongated conductors embedded into a semiconductor substrate, the plurality of conductors having varying conductor widths and adjacent substrate widths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.