Resin mold type semiconductor device
US5723900A · kind A · utility
41Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 1997 |
| Grant date | Mar 3, 1998 |
| Priority date | — |
| Expiry date | Feb 12, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ultra thin resin mold semiconductor device can be provided. A resin mold type semiconductor device is arranged so that a semiconductor chip is disposed within a range of the thickness of a lead frame and sealed with a resin mold, that the thickness of the semiconductor device is defined by the thickness of the lead frame, and that an upper surface, a lower surface and a side surface of a terminal portion formed by the lead frame are exposed from the surface of the resin mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.