Electromechanical assembly having a lid which protects IC chips and holds contact springs
US5724229A · kind A · utility
7Cited by
10References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 1996 |
| Grant date | Mar 3, 1998 |
| Priority date | — |
| Expiry date | Mar 27, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A pressure-mountable, electro-mechanical assembly includes a housing which holds an integrated circuit chip in an open cavity; and, the housing has conductors that connect the chip to a pattern of metal pads on an exterior surface of the housing. A lid lies on the exterior surface of the housing, covers the cavity, and has terminal holes that match and expose the pattern of metal pads. Respective conductive springs are held in the terminal holes, contact the metal pads, and project from the lid. This lid operates as both a protective cover for the chip and a carrier for the springs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.