Patent · US Expired

Apparatus for and method of polishing and planarizing polycrystalline diamonds, and polished and planarized polycrystalline diamonds and products made therefrom

US5725413A · kind A · utility

14Cited by
19References
29Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 6, 1994
Grant dateMar 10, 1998
Priority date
Expiry dateMay 6, 2014

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB24B37/04
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

Disclosed are polished and planarized diamond films and a method and apparatus for polishing and planarizing diamond films. The method generally includes mechanical polishing of the diamond film against a ceramic surface in the presence of a treating agent of potassium nitrate and a polishing agent of potassium hydroxide. The produced films have an average surface roughness on the order of 0.05 microns, a planarization uniformity within eight percent, and are relatively free of process-induced contaminants.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.