Process for micromechanical fabrication
US5725729A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 15, 1996 |
| Grant date | Mar 10, 1998 |
| Priority date | — |
| Expiry date | Aug 15, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0831
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An improved process for fabricating micromechanical devices having movable members, such as gyros and accelerometers. A starting wafer includes an oxidized silicon wafer which has been wafer bonded to a second silicon wafer which has a thin N layer on a P substrate. The wafer is patterned, doped and etched in a series of process steps which include the deposition of epitaxial layers to configure critical device dimensions and geometry. Metallizations are deposited for electrical/electronic interconnections. The process includes an ability to integrate on-chip electronics on the silicon substrate. Alignment difficulties and thermal mismatch associated with prior art processes are minimized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.