Thermally enhanced flip chip package and method of forming
US5726079A · kind A · utility
76Cited by
6References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 17, 1996 |
| Grant date | Mar 10, 1998 |
| Priority date | — |
| Expiry date | Sep 17, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally conductive planar member is in thermally conductive communication with a flip chip encapsulated within a dielectric material that surrounds portions of the thermally conductive planar member, the flip-chip, and a predefined portion of a substrate member. The present invention provides a flip chip package having pick-and-place capability without the thermal resistance disadvantage of capped chip packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.