Eric A. Johnson
130Patents
32h-index
124Co-inventors
93Inventor score
Filing activity: Jun 5, 1978 → Mar 24, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4642618A | Tool failure detector | Performing Operations; Transporting | 1,006 | Expired |
| US5345595A | Apparatus and method for detecting fraudulent telecommunication activity | Electricity | 320 | Expired |
| US5877043A | Electronic package with strain relief means and method of making | Electricity | 223 | Expired |
| US5615408A | Apparatus and method for credit based management of telecommunication activity | Electricity | 180 | Expired |
| US5512547A | Pharmaceutical composition of botulinum neurotoxin and method of preparation | Emerging Cross-Sectional Technologies | 130 | Expired |
| US6490161B1 | Peripheral land grid array package with improved thermal performance | Electricity | 130 | Expired |
| US5412534A | Modular housing | Physics | 115 | Expired |
| US6913948B2 | Partially captured oriented interconnections for BGA packages and a method of forming the interconnections | Electricity | 91 | Expired |
| US5883430A | Thermally enhanced flip chip package | Electricity | 90 | Expired |
| US6665186B1 | Liquid metal thermal interface for an electronic module | Electricity | 77 | Expired |
| US5726079A | Thermally enhanced flip chip package and method of forming | Electricity | 76 | Expired |
| US7038470B1 | Parallel-plate capacitive element for monitoring environmental parameters in concrete | Physics | 76 | Expired |
| US5696077A | Pharmaceutical composition containing botulinum B complex | Emerging Cross-Sectional Technologies | 76 | Expired |
| US5756468A | Pharmaceutical compositions of botulinum toxin or botulinum neurotoxin and methods of preparation | Emerging Cross-Sectional Technologies | 75 | Expired |
| US6507116B1 | Electronic package and method of forming | Electricity | 73 | Expired |
| US5939070A | Hybrid botulinal neurotoxins | Emerging Cross-Sectional Technologies | 73 | Expired |
| US5760465A | Electronic package with strain relief means | Electricity | 72 | Expired |
| US6534374B2 | Single damascene method for RF IC passive component integration in copper interconnect process | Electricity | 67 | Expired |
| US6319958A | Method of sensitizing microbial cells to antimicrobial compound | Human Necessities | 66 | Expired |
| US6274474A | Method of forming BGA interconnections having mixed solder profiles | Emerging Cross-Sectional Technologies | 63 | Expired |
| US7143644B2 | Device for collecting statistical data for maintenance of small-arms | Mechanical Engineering; Lighting; Heating | 62 | Expired |
| US6104093A | Thermally enhanced and mechanically balanced flip chip package and method of forming | Electricity | 61 | Expired |
| US6528892B2 | Land grid array stiffener use with flexible chip carriers | Electricity | 60 | Expired |
| US7551058B1 | Sensor for monitoring environmental parameters in concrete | Physics | 56 | Expired |
| US6774474B1 | Partially captured oriented interconnections for BGA packages and a method of forming the interconnections | Electricity | 51 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.