Multiple chip module assembly for top of mother board
US5729433A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 30, 1996 |
| Grant date | Mar 17, 1998 |
| Priority date | — |
| Expiry date | Jan 30, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/325
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An assembly for electronic components having heat spreaders on two sides comprises a mother board on which to mount electronic components, having a top side with an array of board contacts. A multiple chip integrated circuit module carries integrated circuits. The multiple chip module consists of a first substrate, such as aluminum, with a multi-layer interconnect structure on one surface of the aluminum substrate. The integrated circuits are mounted on the interconnect structure on the first substrate. A second substrate manufactured using printed wiring board technology, surrounds the first substrate, and includes an interconnect structure and an array of circuit contacts. Conductors connect the interconnect structure on the first substrate with the interconnect structure on the second substrate. A thermally conductive baseplate is coupled with the multiple chip module on the side opposite the array of circuit contacts. An interposer providing electrical connection between the array of circuit contacts on the multiple chip module and the array of board contacts on the printed wiring board is placed between the multiple chip module and the board. A top heat sink, such as a heat sp…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.