Inventor · Cupertino, CA, US

Sammy Mok

26Patents
15h-index
18Co-inventors
74Inventor score

Filing activity: Feb 16, 1995 → Aug 24, 2009

Most-cited inventions

PatentTitleAreaCited byStatus
US6917525B2 Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs Emerging Cross-Sectional Technologies 137 Expired
US6812718B1 Massively parallel interface for electronic circuits Physics 134 Expired
US6791171B2 Systems for testing and packaging integrated circuits Electricity 76 Expired
US6815961B2 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies Electricity 73 Expired
US7621761B2 Systems for testing and packaging integrated circuits Electricity 63 Active
US7579848B2 High density interconnect system for IC packages and interconnect assemblies Physics 57 Expired
US5619399A Multiple chip module mounting assembly and computer using same Electricity 53 Expired
US6799976B1 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies Electricity 49 Expired
US5703753A Mounting assembly for multiple chip module with more than one substrate and computer using same Electricity 49 Expired
US5729433A Multiple chip module assembly for top of mother board Electricity 46 Expired
US7382142B2 High density interconnect system having rapid fabrication cycle Emerging Cross-Sectional Technologies 35 Expired
US7126220B2 Miniaturized contact spring Electricity 31 Expired
US7247035B2 Enhanced stress metal spring contactor Electricity 31 Expired
US7009412B2 Massively parallel interface for electronic circuit Physics 30 Expired
US7872482B2 High density interconnect system having rapid fabrication cycle Emerging Cross-Sectional Technologies 15 Active
US8531202B2 Probe card test apparatus and method Physics 14 Active
US7126358B2 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies Electricity 9 Expired
US7138818B2 Massively parallel interface for electronic circuit Physics 9 Expired
US7952373B2 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies Physics 8 Active
US7403029B2 Massively parallel interface for electronic circuit Physics 8 Active
US7137830B2 Miniaturized contact spring Electricity 7 Expired
US7876087B2 Probe card repair using coupons with spring contacts and separate atachment points Emerging Cross-Sectional Technologies 5 Active
US7812626B2 High density interconnect system for IC packages and interconnect assemblies Physics 3 Active
US6710609B2 Mosaic decal probe Physics 2 Expired
US7884634B2 High density interconnect system having rapid fabrication cycle Emerging Cross-Sectional Technologies 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.