Heat sink and fan for cooling CPU chip
US5734554A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 1996 |
| Grant date | Mar 31, 1998 |
| Priority date | — |
| Expiry date | Jul 1, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Because of space limitations, a small heat sink and a fan (of about 2".times.2".times.1/2" size) is used to cool to below 105.degree. C. (at an ambient temperature of about 40.degree. C.) a CPU chip (of about 16 mm.times.16 mm size) which uses about 30 watts current and is mounted on a motherboard of considerably larger size. A heat transferring thermostrate washer covers the chip and a pad covers the washer. Soldered to the pad is a square heat slug. Studs extend upward from the slug. The studs fit through holes in the base of the heat sink. The heat sink is of the type having plural rectangular cross-section fins extending upwardly from the base. Above the heat sink is a fan attached to the motherboard by screws at its four corners extending through heat slug and into the motherboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.