Methods and equipment for anisotropic, patterned conversion of copper into selectively removable compounds and for removal of same
US5736002A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Aug 22, 1994 |
| Grant date | Apr 7, 1998 |
| Priority date | — |
| Expiry date | Aug 22, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76838
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods and equipment for anisotropic, patterned conversion of copper into selectively removable compounds and for removal of the same are disclosed. In one embodiment a plasma reactor is used to anisotropically convert unmasked portions of a copper layer at low temperature into copper chloride. The copper chloride is removed by one or more of the following steps: (1) solvation by a solvent specific to the copper chloride; (2) vaporizing the copper chloride away; and (3) converting the copper chloride into a volatile, secondary compound. In another embodiment an ion implanter is used to anisotropically convert desired portions of a copper layer into copper oxide. The copper oxide is removed by one or more of the following steps: (1) solvation by a solvent specific to the copper oxide; (2) vaporizing the copper oxide away; and (3) converting the copper oxide into a volatile, secondary compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.